The VisionPro AP500 SPI system incorporates the most advanced, rapid 3-D inspection technology within a stylish vibration-free, fully automated platform. Designed with feature-rich software including onboard real-time SPC, customized data reports and simple-to-use GerberProTM conversion programming software, the VisionPro AP500 has become the industry standard for fully automated, offline SPI around the globe.
TheVisionPro M Series of SPI systems incorporates the most advanced, rapid 3-D inspection technology coupled with an intuitive Windows® 7 OS and packaged in a rugged, bench-top platform. Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated, making the VisionPro M500 an exceptional value for electronics manufacturers concerned with improving production yields. Designed with feature-rich software, including onboard real-time SPC run charts, customized data reports, simple-to-use GerberProTM conversion programming software and two sensor technology options, laser and structured white light, the VisionPro M Series is the price to performance leader for offline SPI solutions available on the market today.
Dual Mode AOI / SPI from ASC International for under $50,000!
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ASC International, a leading manufacturer of 3-D solder solder paste inspection and automated opitcal inspection (AOI) systems, today announced that it will exhibit in Booth #516 at SMTA International,scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the new LineMaster DM platform, VisionPro AP500 and VisionPro M Series (SP3D / M500).
The new LineMaster DM incorporates SPI and AOI into one platform for “Dual Mode” performance. The solid AOI / SPI platform validates the overall variables associated with component placement and solder paste printing. Combining both inspection capabilities within one platform, the LineMaster DM detects absence/presence, polarity, OCV, misalignment, RDI and solder joint inspection for AOI and the most accurate and repeatable true 3D volumetric measurements for SPI. System features include real-time SPC, customized data reports, offline CAD / Gerber programming and defect repair station. All wrapped together with an affordable price tag similar to purchasing both inspection capabilities for the same price of as one solution alone.